Wafers used in the fabrication of integrated circuits and photovoltaics require exacting thickness tolerances to meet stringent semiconductor performance criteria. Bristol’s non-contact optical thickness gauges measure Si, GaN, and other semiconductor wafer material in real-time with sub-micron accuracy.
- Non-contact optical technique means no damage, deformation or reduced yield as a result of the measurement process
- System utilizes a 1.3 micron light source which allows imaging of semiconductor material which may be opaque to visible light but is transparent at longer wavelengths
- Real-time results for fast testing throughput
- Included Opti-Cal ™ software offers a QC Mode which provides easy to understand PASS/FAIL measurements based on your design criteria
Figure 1: Opti-Cal ™ software screenshot that shows measurement results for a typical semiconductor wafer. The software is in QC Mode, and shows the wafer measurement is in spec and highlighted in green. If the wafer was out of specification, it would be highlighted in red.